APTE

A globally-competitive work force

A globally-competitive work force with theoretical, as well as hands-on, education must be trained. In addition to the areas of science, engineering, microelectronics and packaging, this training must encompass the broader areas of business, economics, ethics, foreign culture and languages.

Association for Promoting Electronic Technology APTE

The Association for Promoting Electronics Technology has currently 88 members. APTE was founded in 2002, by the Center for Technological Electronics and Interconnection Techniques, UPB-CETTI, and highly respected members of electronics industry, to sustain the electronics packaging education, in a climate of trust, ethics and social responsibility.

Kick-off conference for project ESCA-IPS

Antet-Proiect-POSCCE

SMEs in the electronics field are expected at the kick-off conference for the ESCA-IPS project aimed at supporting ELINCLUS cluster’s activities

   The Association for Promoting Electronic Technology (Asociația pentru Promovarea Tehnologiei Electronice, APTE), the management entity of the Electronic Innovation Cluster - ELINCLUS, will organize on the 7th of July, in Bucharest, at the Faculty of Electronics, Telecommunications and Information Technology (Bd. Iuliu Maniu, no. 1-3, sector 6, Bucharest), Building A, 1st floor, room A102, the kick-off event for the project “Entitate Suport Colaborativ Avansat pentru Inovare de Produse şi Servicii - ESCA-IPS” ("Advanced Collaborative Support Entity for Products and Services Innovation"), SMIS Code: 49741, co-financed by the European Regional Development Fund through the Operational Programme " Creşterea Competitivităţii Economice  (Increase of Economic Competitiveness (POS CCE) 2007-2013" "Investments for your future!".

Representatives of cluster members as well as potential members, namely SMEs in the Bucharest-Ilfov region who are specialized in electronics and related fields, are invited to this conference.

Participants at the conference will gain useful information regarding project activities, how to gain access to these activities and benefits for members of the ELINCLUS cluster. Among the activities of the project, we can highlight: access to assistance in obtaining funds for development, promoting partnerships, increasing the customer database and the supplier database (new), cluster members may be represented or participate in trade fairs, exhibitions and economic missions, brokerage events, mentoring/coaching sessions on topics such as: innovation, leadership, controlling, change management and operations management, etc..

At this moment ELINCLUS has 48 members (36 SMEs, 8 research centres, one institution of higher education, two NGOs, one regional authority) from the Bucharest-Ilfov region; this entities, by working synergistically, aim to support the entire value chain involved in the development of innovative electronic products. Currently ELINCLUS is one of the five Romanian clusters who have obtained the Bronze Label from ESCA ("The European Secretariat for Cluster Analysis"), and in the frame of the project we plan to obtain the Gold Label.

The project “Entitate Suport Colaborativ Avansat pentru Inovare de Produse şi Servicii - ESCA-IPS” ("Advanced Collaborative Support Entity for Products and Services Innovation") will take place between May 13, 2014 - October 12, 2015.

For more information on the conference agenda, please visit www.elinclus.ro. Contact person: Florentina Stalinescu, PR representative, e-mail: florentina.stalinescu@elinclus.ro.

logo_ELINCLUS_bronze_v2_3 logo_APTE_text

 

International Symposium SIITME 2014

SIITME 2014

The organising committee of SIITME 2014  invites you to submit an abstract/paper to the 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Bucharest, on October 23rd–26th, 2014. Web page: http://www.siitme.ro

SUBMISSION OF ABSTRACTS AND PAPERS

 Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document, Version 97 or later, and as PDF document, attached to an e-mail to siitme@siitme.ro.

Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library.
Abstracts and papers will be reviewed by the international Scientific Committee.

1.  Each abstract will be reviewed on:
- suitability for one of the topics of the conference
- scientific content and level, and the relevance of presented results;
- correspondence with the abstract template, English usage and grammar.

Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2.  Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
- the comments of the reviewers have been taken into consideration;
- originality of the paper[1] is given;
- it corresponds with the paper template, English usage and grammar are correct,
- signed IEEE copyright form has been submitted.

TOPICS

A. Emerging Technologies & Trends in Advanced Packaging, Printed Electronics
B. Power Electronics and Microsystems Packaging
C. Assembly and Manufacturing Technology
D. Design of Electronic Circuits and Systems
E. Electronics Simulation & Modelling
F. Electronics Applications
G. Optoelectronics & Advanced Communication Packaging
H. Applied Reliability
I. Challenge in Global Education

IMPORTANT DATES

Submission of abstracts: September 7th, 2014
Notification of abstract acceptance: September 21st, 2014
Submission of camera-ready papers and copyright forms: October 5th, 2014
Registration deadline: October 15th, 2014

CHAIRS

General Chair: Paul SVASTA, “Politehnica” University of Bucharest, RO
General Co-Chair: Dan PITICĂ, Technical University of Cluj-Napoca, RO
Conference Chair: Norocel CODREANU, “Politehnica” University of Bucharest, RO
Conference Co-Chair: Ciprian IONESCU, “Politehnica” University of Bucharest, RO
Technical Program Committee Chair: Detlef BONFERT, Fraunhofer EMFT in Munich, DE
Awards Committee Chair:  Heinz WOHLRABE, Technical University of Dresden, DE
Publication Committee Chair: Zsolt ILLYEFALVI-VITÉZBudapestUniversity of Technology and Economics, HU

CONFERENCE REGISTRATION 

The conference fee includes the opening ceremony and welcome reception, full access to all technical (oral and poster) sessions, exhibition area, all meals (breakfasts, coffee breaks, lunches and dinners), three nights accommodation, printed abstracts proceedings, conference proceedings on memory stick, conference kit (conference bag, badge, booklet, pen, and other related objects), and participation to the cultural programme.

LOCATION
The conference will take place at:
Hotel Yesterday
Economu Cezărescu 8
Bucharest, Romania
http://www.yesterday.ro/

CONTACT INFORMATION:

Registration Officer Delia Lepădatu
0040.720.093.945
0040.769.247.904
Travel Advisor Norocel Codreanu
0040 21 3169633
Multimedia Bogdan Mihăilescu
0040.723.077.221

Tel:       0040 213169633 / 0040 214024638
Fax:      0040 213169634
E-mail:    siitme@siitme.ro
http://www.siitme.ro

Correspondence address:
Splaiul Independentei 313
06042, Bucharest, Romania

Download the Call for Papers – SIITME2014  (PDF format)


 

ELAN Project

Since 2009 APTE promoted the entrepreneurial culture in more than 60 locations (mainly vocational schools and technical universities), with participants from all over the country, also offering  training, technical and technological support for enterprises (more than 100, 27 being partners in ELINCLUS CLUSTER)) and employees (over 4000), to enhance adaptability, entrepreneurship.  As a result we have a data base of over 12500 participants: students, specialist, entrepreneurs, managers, in electronics industry. Apte is also the management unit for ELINCLUS - ELectronic INnovation CLUSter (www.elinclus.ro)  assiting members with national and international  networking; politics, strategies, programs and advocacy; courses, seminars, professional meetings, social events; matchmaking; APTE organizes since 1995 the international symposium SIITME (www.siitme.ro) – The International Symposium for Design and Technology of Electronic Packages and a professional student contest TIE (www.tie.ro/2012)- Interconnection Techniques in Electronics (since 1992). 

Download Powerpoint: ELAN Project Presentation (size: 51MB) 

 

 

The mSysTech project

The mSysTech project is based on the positive results and experiences in two European pilot projects: Leonardo da Vinci project "Internet-based Performance Centred Instruction - the Link between Work and Education" (IPCI) and Socrates/Minerva "On-line Learning Mathematics and Sciences" (OnLine Math&Sciences).

Within the IPCI project a complete set of courses covering microelectronics design, technology and packaging were developed. There are not many frameworks that unify these subjects in an attractive way. This became possible thanks to the financing of the Leonardo da Vinci programme on European level and the transnational work. The different courses have been developed by the experts who are (ones of) the best in the corresponding specialisation in Europe, e.g. University of Twente, the Netherlands - in technology, BUTE, Hungary - in packaging, CIME Nanotech, France - in microsystems and analogue systems design. The performance centred approach has been proven to be more effective than the traditional lecture-practice-test (expository inductive) in training higher order skills, for preparing learners for self-learning, improving, adapting for changing tasks, jobs.

In mSysTech the performance-centred job-linked training approach will be used also and the selected content from the courses of IPCI will by adapted and up-dated for the needs of Romanian and Bulgarian electronic sector and education. The new learning materials on the microsystem technology and the evolution of nanosystems during the last three years (after the end of IPCI) will be developed and used by all partners in the project, as well by the partners from the IPCI project who are not in the mSysTech partnership.

Within OnLineMath&Sciences a learning platform for stand-alone learning, simulations, group-working at a distance and Scenari - software for multimedia course development was created, full courses in mathematics, physics and chemistry for the first two years of university education were designed and implemented in the regular curricula. In the mSysTech project we will select the Java applets for simulation of selected content, Scenari for the design of new multimedia materials in microsystem technology.

 

TIE - the best-of-Europe IEEE-CPMT student event

Every year the best PCB CAD designer students from the area of the Central European Hu&Ro IEEE-CPMT Chapter get together to match their skills against each other, as well as, with the rapidly developing computer aided design techniques.

The innovative Electronics Interconnection Technology Design (TIE) one day hands-on real-time competition is really an unrivalled Component Packaging and Manufacturing Technology event in Europe, the best for undergraduates in electronics. The event comprises a day of workshops and another day of competition in the organization of CETTI of Politehnica University of Bucharest, the IEEE-CPMT Romanian Student Branch and the Hu&Ro Chapters, as well as, lots of sponsors who are interested in skilled designers for the European industry.

The workshops include lectures and discussions by professionals with the intention to give students insight into the practicalities of the outside world. Not only the competitors but other industrial engineers, scientists and professors attend the workshops.

On the second day the workshops are followed by the excellent student competition. Each undergraduate student competitor has to carry out a circuit design and layout project within four hours, under high time pressure. The design requirements are defined to the student competitors just before the competition begins. Each student is provided with a computer with a suite of design software and a high definition color screen. The students are required to develop a parts library, create component footprints, create a schematic and complete a layout. The adjudication is by small teams of experienced CAD designers plus anyone else who wishes to intervene, thus having a fully transparent process.

Some 50 students (both female and male) participate in the competition and year by year they display impressive skills. The prizes to the top three are financial scholarships to support their ongoing education. All the funds are received from sponsors. IEEE-CPMT offers free student membership for the winner.

The 20th TIE will be the third opportunity for a Hungarian group of students and me to attend this unique event. In the first occasion, the 28th TIE 2009 was organized in Galati, Romania, where - in addition to the interesting workshops and the exciting competition - we enjoyed the warm hospitality of the professors and students of the Universitatea Dunarea de Jos, as well as, the nice panorama of the city along the bank of the unthinkably wide Danube. Last year, in 2010, it was our pleasure to visit the beautiful cultural capital of Transylvania, where our old friends, the team of Professor Dan Pitica from the Technical University of Cluj-Napoca hosted the competition. The most popular for ever competition was completed by an interesting excursion to the exceptional salt mine of Turda.

This year we are looking forward to participating in the jubilee 20th anniversary competition of TIE in Bucharest and to meeting our best friends and colleagues from CETTI of Politehnica University of Bucharest, headed by Professor Paul Svasta, the ever enthusiastic researcher and educator in the field of electronics design and packaging technology.

Zsolt Illyefalvi-Vitéz
dr.techn (BME), CSc/PhD (MTA/BME), DHC (UPB)
Budapest University of Technology and Economics (BME)
Department of Electronics Technology (ETT)
Goldman t. 3, Budapest, Hungary, 1111
E-mail: illye@ett.bme.hu Tel: +36 1 463 2753 Fax: +36 1 463-4118 www.ett.bme.hu

 

Oferta de cursuri IPC si de Analiza a Calitatii Asamblarii

Oferta de cursuri certificate IPC / SUA sustinute prin APTE (Asociatia pentru Promovarea Tehnologiei Electronice – www.apte.org.ro ) in cadrul CETTI-ITA (Incubatorul Tehnologic si de Afaceri  din Universitatea Politehnica din Bucuresti, Centrul de Electronica Tehnologica si Tehnici de Interconectare UPB-CETTI, www.cetti.ro, www.cetti.ro/ita).

Pentru membri APTE, persone fizice sau juridice se acorda:
       -  Reduceri pentru taxa de participare la cursurile promovate de asociatie;
       -  Publicitate gratuita in cadrul concursului TIE si conferintei SIITME;
       -  Reduceri pentru tarifele de consultanta tehnico-economica si suport tehnologic oferit prin incubatorul CETTI-ITA;
       -  Reduceri privin costurile de participare si/sau publicitate la Saloanele Regionale respectiv Salonul National al Cercetarii.

Calitatea de membru APTE se obtine prin depunerea in acest sens a unei cereri pe adresa de mail: apte@apte.org.ro si presupune o taxa de membru platibila in doua transe, in valoare de:
       -   5Lei/luna (60Lei/an) pentru persone fizice;
       -   50Lei/luna (600Lei)an pentru personae Juridice.

Pentru mai multe detalii descarcati oferta.

 

Welcome Message from the President


Prof. Dr. Eng.
Paul Svasta

The Association for Promoting Electronics Technology has currently 88 members. APTE was founded in 2002, by the Center for Technological Electronics and Interconnection Techniques, UPB-CETTI, and highly respected members of electronics industry, to sustain the electronics packaging education, in a climate of trust, ethics and social responsibility.

A globally-competitive work force with theoretical, as well as hands-on, education must be trained. In addition to the areas of science, engineering, microelectronics and packaging, this training must encompass the broader areas of business, economics, ethics, foreign culture and languages.

Our vision is to support developments on both these fronts which will benefit the microelectronics industry today and in the future.

 

About the Association for Promoting Electronic Technology APTE

The Association for Promoting Electronics Technology has currently 88 members. APTE was founded in 2002, by the Center for Technological Electronics and Interconnection Techniques, UPB-CETTI, and highly respected members of electronics industry, to sustain the electronics packaging education, in a climate of trust, ethics and social responsibility.

In addition to the areas of science, engineering, microelectronics and packaging, the training encompass the broader areas of business, economics.

APTE offers annually a comprehensive set of short courses on electronic packaging technologies, standards training and certification, management, industrial organization, designed to serve the needs of electronic industry. Apte is organizing and sponsoring annually International Symposium for Design and Technology of Electronic Packages and TIE Students Professional Contest.

 

APTE was founded in 2002, by the Center for Technological Electronics and Interconnection Techniques, UPB-CETTI, and highly respected members of electronics industry, to promote the electronics packaging education.